Wafer and die thinning technology
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Advanced Search Powered by KSearch 1.5b Die ThinningThe process of thinning a wafer or die changes the following properties: mechanical, electrical, optical.The process of thinning a wafer or die changes the following properties: mechanical, electrical, optical. Thinning can be accomplished on the whole wafer or individual die. A standard patterned wafer can be thinned to a thickness of less than 75 microns, depending on size and inherent stresses, and individual die processed even thinner. Thinned and polished wafers on the backside have less stress as opposed to standard backgrinding and therefore when diced, will have fewer backside cracks and chip-outs. Dicing and thinning process consists of dicing the wafer to a predetermined depth and then thinning from the backside leaving the surface as desired: rough, semi polished or fully polished. We can also polish completely singulated chips to any thickness and tolerance. Typical semiconductor materials thinned as wafers or dice include:
We can handle all your state-of-art dicing, thinning and polishing needs for semiconductor and MEMS materials as well as Glass, Quartz, Fused Silica, Sapphire, Ceramics and composites. Wafer and die thinning related Web pages:
Updated: 16 Jan 2009 |
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