Edge, Angle-Facet Optical Polishing for Optoelectronics
Edge polishing, waveguide angle-facet polishing, end polishing, optical polishing, fiber optic polishing, dicing, flat lapping and machining of all hard materials including Ceramic substrates, Quartz, AlN, Glass and Sapphire windows, Silicon wafers and very thin substrates and windows.
- Fused Silica, Silicon, Silicon/Oxide hybrids, Sapphire, LiN, Pyrex, Phosphate Glass, LiTaO3 and many others used in optical and optoelectronic devices
- Edge, angle end face optical polishing of Waveguides, Edge Mirrors, VOA, AWG, Dynamic Gain Equalizers, Beamsplitter
Many optoelectronic manufacturers of devices such as Waveguides, Edge Mirrors, VOA, AWG, Dynamic Gain Equalizers and Beamsplitters are beginning to acknowledge the effect end face optical polishing has on optimizing the optical performance of these devices. Valley provides edge and angle optical polishing to 1, 8, 45 or any other degree for various substrate materials including Fused Silica and Silicon which are typically used in these and other optical devices.
End face refers to the depth x width of the cross sectional area of a substrate with depth, width and length. Typically, the area is 9 - 40 mm x 0.7 - 1 mm, and may incorporate, for example, an 8 degree angle relative to the normal length x width plane. Optical waveguides begin and end at these faces. Traditionally, these edges have been diced, leaving a chipped edge. However, by utilizing Valley's new technology, which achieves an optical quality edge surface finish with chipping of less than 1 micron, improved optical performance can now be realized.
One of the major challenges of optical edge polishing involves compensating for the height differential which occurs during polishing hybrids of silicon and oxide layers. This can also occur with epoxy filled waveguide structures. Other issues include poor flatness results, and excessive rounding. Valley has successfully overcome these obstacles and meets the following typical optical specifications:
- Edge chips < 1 micron
- Surface finish < 10-15 Angstroms (10/5 scratch/dig)
- No visible scratching under 50X magnification
- No visible defects in Silica layer under 500X magnification
- Edge plane orientation ± .1 degree
- Oxide rolloff < 1000 Angstroms
- Flatness < 3.5 microns per 10 mm
Valley also edge polishes other materials including Silicon/Oxide hybirds, Lithium Niobate, Sapphire, metalized Fused Silica, Lithium Tantalate, AR coated Pyrex and Phosphate Glass.
For over 25 years, Valley has been a leader in materials processing. We offer precision lapping, optical polishing, dicing, optical edge polishing, thinning, grinding, shaping, and wafering services. We particularly specialize in ultra-thin substrates (as thin as 12.5 microns, for 1 cm sq.), and tight tolerances (± 1 micron). Other capabilities include:
- Surface Finishes < 10/5 Scratch/Dig or 5-10 Angstroms
- Dicing as small as 0.005" square
- Thickness Tolerance ± 0.1 micron
- Parallelism to 0.1 micron
- Flatness to 1/20 Wave
Valley provides custom parts, as well as in-stock items. We process prototype orders, as well as full production runs, and currently process over 1,000 parts daily for our customers worldwide. With facilities on both East and West Coasts, we operate three shifts, and are ready to serve our customers from 7:30 a.m. EST to 5:00 p.m. PST.
We have extensive experience with a wide variety of materials, and are willing to work with proprietary materials as well. Valley routinely processes:
- 1737, 7070 Glass
- 99.6% and 96% Alumina
- Aluminum Nitride
- BK7, B270, D263, AF45 Glass
- Filter Glass
- Fused Silica
- GaAs, GaP, GaN
- Lithium Niobate
- PLZT, PZT
- Soda Lime
Plus many others:
We also stock a large quantity of Fused Silica, 99.6% Alumina, Aluminum Nitride, R-Plane Sapphire and Float Zone Silicon.
Please fax or e-mail your specifications for quotation. We look forward to working with you!
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Last Updated 19 September 2013